MKJ33W Low-temperature adhesive/shape-memory material compatible interlining
MKJ33W Low-temperature adhesive/shape-memory material compatible interlining
Low-temperature adhesion is possible for shape-memory materials and hard-to-adhere materials, and adhesion is possible from 110°C. Special original resin SDDC is used to prevent resin marks, stains, and glare. Standard type.
| サイズ | 122cm x 50m Random |
|---|---|
| 素材 | 100% polyester% |
| 納期 | Minimum 3 days Maximum 1.5 months |
Standard stock items
*Even if you add them separately, the total will be added together when you add them to your cart. Please either separate your orders, or, if ordering fabric, please write "I would like it cut separately" in the comments section.
注意事項
When bonding, use standard press conditions.
Please be sure to conduct a preliminary test on a sample to check the appearance, adhesive strength, fabric strength, etc. before proceeding.
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